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1 jan. 2011 rev. 1. 8 bcd semiconductor manufacturing limited data sheet 1.5a ultra low dropout linear regulator az39151 general description the az39151 is a 1.5a, hi gh accuracy linear voltage regulator. it features 375mv dropout voltage at 1.5a output current and low ground current over all operat- ing conditions . the az39151 is specifically designed for low voltage, high current output systems, such as pc add-in cards where their tiny dropout voltage and ground current values are important attributes. the az39151 has 3.3v and 5.0v versions. the az39151 is available in to-252-4 (ppak) pack- age. features minimum guaranteed output current: 1.5a low dropout voltage: 375mv at i out =1.5a output accuracy: 1% low ground current internal current and thermal limit reversed-battery and reversed-lead insertion protection fast transient response ttl/cmos compatible enable pin applications set-top box hi-end dvd player/recorder lcd tv/pdp ldo linear regulator for pc add-in cards high efficiency lin ear power supplies smps post regulator figure 1. package type of az39151 to-252-4 (ppak)
2 jan. 2011 rev. 1. 8 bcd semiconductor manufacturing limited data sheet 1.5a ultra low dropout linear regulator az39151 figure 2. pin configuration of az39151 (top view) pin configuration pin description pin number pin name function 1 en enable: ttl/cmos compatib le input. logic high=enable; logic low or open=shutdown 2 vin unregulated input 3 gnd ground pin. this pin and tab are internally connected 4 vout regulated output 5 nc no connection d4 package to-252-4 ( ppak ) 1 2 3 4 5 en vin gnd vout nc
3 bcd semiconductor manufacturing limited data sheet 1.5a ultra low dropout linear regulator az39151 jan. 2011 rev. 1. 8 functional block diagram figure 3. functional block diagram of az39151 v in en v out gnd reference thermal shutdown o.v. i limit 1 2 3 4
4 jan. 2011 rev. 1. 8 bcd semiconductor manufacturing limited data sheet 1.5a ultra low dropout linear regulator az39151 ordering information circuit type e1: lead free az39151 - package blank: tube d4: to-252-4 (ppak) 5.0: fixed output 5.0v tr: tape and reel g1: green 3.3: fixed output 3.3v package temperature range part number marking id packing type lead free green lead free green to-252-4 (ppak) -40 to 125 o c az39151d4-3.3e1 az39151d4-3.3g1 az39151d4-3.3e1 az39151d4-3.3g1 tube az39151d4-3.3tre1 az39151d4-3.3trg1 az39151d4-3.3e1 az39151d4-3.3g1 tape & reel az39151d4-5.0e1 az39151d4-5.0g1 az39151d4-5.0e1 az39151d4-5.0g1 tube az39151d4-5.0tre1 az39151d4-5.0trg1 az39151d4-5.0e1 az39151d4-5.0g1 tape & reel bcd semiconductor's pb-free products, as designated with "e1" suffix in the part number, are rohs compliant. products with "g1" suffix are available in green packages.
5 bcd semiconductor manufacturing limited data sheet 1.5a ultra low dropout linear regulator az39151 jan. 2011 rev. 1. 8 parameter symbol min max unit input voltage v in 13.5 v enable voltage v en 13.5 v operating junction temperature t j -40 125 o c note 1: stresses greater than those listed under "absolute maximum ratings" may caus e permanent damage to the device. these are stress ratings only, and functi onal operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. exposure to "absolut e maximum ratings" for extended periods may affect device reliability. parameter symbol value unit input voltage v in 15 v enable voltage v en 15 v operating junction temperature t j 150 o c storage temperature range t stg -65 to 150 o c lead temperature (soldering, 10sec) t lead 260 o c esd (human body model) esd 5000 v esd (machine model) esd 450 v thermal resistance ja to-252-4 (ppak) 100 o c/w absolute maximum ratings (note 1) recommended operating conditions
6 jan. 2011 rev. 1. 8 bcd semiconductor manufacturing limited data sheet 1.5a ultra low dropout linear regulator az39151 electrical characteristics parameter symbol conditions min typ max unit output voltage v out -1 1 % 10ma i out 1.5a, v out +1v v in 13.5v -2 2 line regulation v rline v out +1v v in 13.5v 3 25 mv load regulation v rload 10ma i out 1.5a 10 50 mv output voltage temperature coefficient (note 2) ? v out / ? t 100 500 v/ o c ( ? v out /v out )/ ? t 20 100 ppm/ o c dropout voltage (note 3) v drop ? v out =1% i out =100ma 80 200 mv i out =750ma 260 mv i out =1.5a 375 700 mv ground current i gnd i out =750ma 5 10 ma i out =1.5a 17 34 ma standby current i std v in =13.5v, v en =0v 130 220 a dropout ground pin current i gnd(do) v in v out(nominal) -0.5v 5 ma short circuit current i short v out =0v 2.8 a output noise voltage (rms) 10hz to 100khz, i out =100ma 200 v minimum load current i load (min) 5ma power supply ripple reje ction psrr f=120hz, i out =750ma 49 65 db enable input enable voltage v en logic low (off) 0.8 v logic high (on) 2.25 enable current i en v en =v in 15 35 a v en =0.8v 4 shutdown output current i out (shdn) v en 0.8v, v in 8v, v out =0v 5 10 a operating conditions: v in =v out +1v, i out =10ma, c in =10 f , c out =10 f , t j =25 o c, unless otherwise specified. the bold- face applies over -40 o c t j 125 o c. note 2: output voltage temperat ure coefficient is defined as the worst case voltage change divided by the total temperature range. note 3: dropout voltage is defined as the input-to-output differential when the output voltage drops to 99% of its nominal valu e which is measured at v out +1v applied to v in .
7 bcd semiconductor manufacturing limited data sheet 1.5a ultra low dropout linear regulator az39151 jan. 2011 rev. 1. 8 typical performance characteristics figure 4. dropout volt age vs. output current figure 5. dropout voltage vs. junction temperature figure 6. output voltage vs. input voltage figure 7. ground current vs. input voltage 0 250 500 750 1000 1250 1500 0 50 100 150 200 250 300 350 400 450 500 dropout voltage (mv) output current (ma) v in =6v t j =25 o c -25 0 25 50 75 100 125 100 150 200 250 300 350 400 450 500 550 600 650 700 v out =v out(nominal) x99% i out =1.5a dropout voltage (mv) junction temperature ( o c) 0 2 4 6 8 10 12 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 v en =2.5v t j =25 o c output voltage (v) input voltage (v) 10ma 1500ma 024681012 0 5 10 15 20 25 30 35 40 45 v en =3.3v t j =25 o c ground current (ma) input voltage (v) i out =10ma i out =750ma i out =1500ma
8 jan. 2011 rev. 1. 8 bcd semiconductor manufacturing limited data sheet 1.5a ultra low dropout linear regulator az39151 typical performance ch aracteristics (continued) figure 8. ground current vs. output current figure 9. ground current vs. junction temperature figure 10. ground current vs. junction temperature 0 200 400 600 800 1000 1200 1400 -3 0 3 6 9 12 15 18 21 24 27 ground current (ma) output current (ma) v in =6v t j =25 o c -40-20 0 20406080100120 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 v in =v en =6v i out =10ma ground current (ma) junction temperature ( o c) -40 -20 0 20 40 60 80 100 120 5 6 7 8 9 10 11 v in =v en =6v i out =750ma ground current (ma) junction temperature ( o c) -40 -20 0 20 40 60 80 100 120 18 19 20 21 22 23 24 25 v in =v en =6v i out =1.5a ground current (ma) junction temperature ( o c) figure 11. ground current vs. junction temperature
9 bcd semiconductor manufacturing limited data sheet 1.5a ultra low dropout linear regulator az39151 jan. 2011 rev. 1. 8 ? v in (2v/div) figure 15. line transient time (10 s/div) -25 0 25 50 75 100 125 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 v in =v en =6v short circuit current (a) junction temperature ( o c) -25 0 25 50 75 100 125 4.970 4.975 4.980 4.985 4.990 4.995 5.000 5.005 5.010 v in =v en =6v i out =10ma output voltage (v) junction temperature ( o c) -25 0 25 50 75 100 125 0 2 4 6 8 10 12 14 16 18 20 v in =v en =6v i out =10ma enable current ( a) junction temperature ( o c) typical performance ch aracteristics (continued) figure 12. short circuit current vs. junction temperat ure figure 13. output voltage vs. junction temperature figure 14. enable current vs. junction temperature ? v out (100mv/div) 0 -2 0 100 -100 2 -200 4 (conditions: v in =5 to 7v, i out =1.5a, c out =10 f)
10 jan. 2011 rev. 1. 8 bcd semiconductor manufacturing limited data sheet 1.5a ultra low dropout linear regulator az39151 typical performance ch aracteristics (continued) time (200 s/div) ? v out (0.5v/div) i out (1a/div) 1 0 0.5 2 0 1 -1 1.5 figure 16. load transient (conditions: v in =6v, i out =10ma to 1.5a, c in =c out =10 f) figure 17. psrr vs. frequency (conditions: v in =6v, i out =10ma, c in =c out =10 f) 10ma 10 100 1k 10k 100k 0 10 20 30 40 50 60 70 80 psrr (db) frequency (hz) figure 18. power dissipation vs. case temperature -25 0 25 50 75 100 125 0 5 10 15 20 25 power dissipation (w) case temperature ( o c) package: to-252-4 (ppak) heatsink size: 45*45mm 2
11 bcd semiconductor manufacturing limited data sheet 1.5a ultra low dropout linear regulator az39151 jan. 2011 rev. 1. 8 typical application figure 19. typical application of az39151 v out gnd + az39151 1 4 3 + 10 f c in v in =6v v out =5v 2 5 v in en nc v en =2.25v 10 f c out
12 jan. 2011 rev. 1. 8 bcd semiconductor manufacturing limited data sheet 1.5a ultra low dropout linear regulator az39151 mechanical dimensions to-252-4 ( ppak ) unit: mm(inch) 0.950(0.037) 1.450(0.057) 0.460(0.018) 0.560(0.022) 6.400(0.252) 6.600(0.260) 2.200(0.087) 2.400(0.094) 0.460(0.018) 0.560(0.022) 5.200(0.205) 5.400(0.213) 5.700(0.224) 5.900(0.232) 5.400(0.213) 5.600(0.220) 1.300(0.051) 1.500(0.059) 0.800(0.031) 1.000(0.039) 2.440(0.096) 2.640(0.104) 0.450(0.018) 0.550(0.022) 4.980(0.196) 5.180(0.204) 9.250(0.364) 9.750(0.384)
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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